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ADVANCED INFORMATION
SMAJ530 AND SMAJ550
SURFACE MOUNT TRANSZORBTM TRANSIENT VOLTAGE SUPPRESSOR
Steady State Power - 1Watt
DO-214AC
Reverse Voltage - 530, 550 Volts
FEATURES
Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Protects TOPSwitch(R) Glass Passivated Junction High temperature soldering guaranteed: 250C/10 seconds at terminals Exellent Clamping capability Available in unidirectional only
0.065 (1.65) 0.049 (1.25)
0.110 (2.79) 0.100 (2.54)
0.177 (4.50) 0.157 (3.99) 0.012 (0.305) 0.006 (0.152)
MECHANICAL DATA
Case: JEDEC DO-214AC molded plastic body over passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: The color band denotes the cathode, which is positive with respect to the anode under normal TVS operation Mounting Position: Any Weight: 0.002 ounces, 0.064 gram
0.090 (2.29) 0.078 (1.98)
0.060 (1.52) 0.030 (0.76) 0.008 (0.203) MAX. 0.208 (5.28) 0.194 (4.93)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
SMAJ530
SMAJ550
UNITS
Device marking code Steady state power dissipation (NOTE 3) Peak pulse power dissipation (NOTE 1,2,5, FIG.1) Minimum breakdown voltage at 100A Maximum clamping voltage at 300mA, 10/1000 s-waveform Stand-off voltage Maximum DC reverse leakage current at VWM Typical thermal resistance Typical thermal resistance Typical temperature coefficient of V(BR) Typical capacitance (NOTE 4) Operating junction and storage temperature range at 0V at 200V CJ TJ, TSTG PM(AV) PPPM V(BR) Vc VWM ID RJL RJA
HD 1.0
SB Watts Watts Volts Volts 495 5.0 27 75 650 75 45 Volts A C/W C/W mVC pF C 550 660
Minimum 300 530 477
-55 to +150
NOTES: (1) Non-repetitive current pulse, per Fig.3 and derated above 25C per - Fig. 2 (2) Mounted on 5.0mm2 copper pads to each terminal (3) Lead temperature at 75C=TL per Fig. 5 (4) Measured at 1MHz (5) Peak pulse power waveform is 10/100S
1/4/99
MAXIMUM RATINGS AND CHARACTERISTIC CURVES SMAJ530 AND SMAJ550
FIG. 1 - PEAK PULSE POWER RATING CURVE PPPM, PEAK PULSE POWER, kW
NON-REPETITIVE PULSE WAVEFORM SHOWN in FIG. 3 TA=25C
PEAK PULSE POWER (Ppp) or CURRENT (IPPM) DERATING IN PERCENTAGE, %
100
FIG. 2 - PULSE DERATING CURVE
100
10
75
1.0
50
25
0.1 0.1s
1.0s
10s
100s
1.0ms
10ms
td, PULSE WIDTH, sec. FIG. 3 - PULSE WAVEFORM
0
0
25
50
75
100
125
150
175
150
IPPM, PEAK PULSE CURRENT, %
PULSE WIDTH (td) is DEFINED as the POINT WHERE the PEAK CURRENT DECAYS to 50% of IPPM
TA, AMBIENT TEMPERATURE, C
tr=10sec.
100
PEAK VALUE IPPM HALF VALUE - IPPM 2
10,000
50
10/1000sec. WAVEFORM as DEFINED by R.E.A.
1,000
td
0
0
1.0
2.0
t, TIME, ms
3.0
4.0
APPLICATION NOTES RECOMMENDED PAD LAYOUT
The pad dimensions should be 0.010" (2.5mm) longer than the contact size in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods.
* Respect Thermal Resistance (PCB Layout) - as the temperature coefficient also
contributes to the clamping voltage.
* Select minimum breakdown voltage, so you get acceptable power dissipation and
PCB tie point temperature. Devices with higher breakdown voltage will have a shorter conduction time and will dissipate less power.
* Clamping voltage is influenced by internal resistance - design approximation is
MODIFIED J-BEND
0.060 MIN (1.52 MIN) 0.094 MAX (2.38 MAX)
7V per 100mA slope.
* Keep temperature of TVS lower than TOPSwitch(R) as a recommendation. * Maximum current is determined by the maximum TJ and can be higher than
300mA. Contact supplier for different clamping voltage / current arrangements.
0.050 MIN (1.27 MIN) 0.220 REF (5.58)
* Minimum breakdown voltage can be customized for other applications.
Contact supplier.
Dimensions in inches and (millimeters)

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